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PRESENTATIONS

At NxGEN we believe our most competitive advantage is our team. With our depth of process knowledge and a wide range of experience, we offer unique variety of services rarely found under one roof. NxGEN prides itself in our dedication and commitment to excellence for all of our customers — big or small. For many of our small customers, time to market is key.

Right-click here to download 2.0 MB

WHITE PAPER AND PRESENTATION

By Don Hayashigawa

Chief Technical Officer

Study for the development of a small form-factor 3D-Microcomputer Module for a military application, based on COTS devices. The process, from establishing the module functional requirements to the development and analysis of a preliminary package design, will be examined. The main discussion will center on how the mechanical, electrical and thermal requirements can be met by adopting different packaging strategies, including CSP stacking, rigid-flex PCB, embedded passives, low profile components and a novel heat sink design. Finally, the results of the analyses done to validate this system-in-package design will be presented.

Right-click here to download the PDF White Paper 200 KB

Right-click here to download the PDF Presentation 263 KB