Application EngineerDate: 11-20-2006 - San Diego, CA FULLTIME, Pay Rate Competitive, Experience in broad technology base. Essential Job Functions:
Experience Desired: Working knowledge of IC package assembly technology, packaging process development, packaging materials, flip chip, multi-chip and three dimensional packaging. Experience with class 1K, 10K clean room protocol, and micro electronics standards including SEMI, Mil-Std, SMEMA, IPC. Knowledge in SPC, DOE, and related analysis techniques. Additional skills: Technical writing and presentations. Education Requirements: BSME, BSEE or equivalent related industry experience. |
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