NxGEN Electronics - Advanced Packaging Specialist

Application Engineer

Date: 11-20-2006 - San Diego, CA
Fax: 858 309 6619
Email: Kathy@NxGENelectronics.com

FULLTIME, Pay Rate Competitive, Experience in broad technology base.

Essential Job Functions:

  • Perform process development, operator training, performance evaluations of new equipment, package development on existing equipment.
  • Develop new operating procedures and improvement of existing procedures.
  • Provide technical sales support including off site customer visits.

Experience Desired:

Working knowledge of IC package assembly technology, packaging process development, packaging materials, flip chip, multi-chip and three dimensional packaging. Experience with class 1K, 10K clean room protocol, and micro electronics standards including SEMI, Mil-Std, SMEMA, IPC. Knowledge in SPC, DOE, and related analysis techniques.

Additional skills: Technical writing and presentations.

Education Requirements: BSME, BSEE or equivalent related industry experience.