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DESIGN
Initial designs are based on the latest inprocessor and memory technologies. The NxGEN systems approachto engineeringthese designs requires knowledge of com-puter architectures, high-performance I/O structures, and interactions between archi-tectures and software as they affect moduleperformance. The initial designs are being conducted for government applications in an extremelyrugged environment. The team at NxGEN has years of experience in relevant technology areas, backed up by the outstanding design team at Tessera Technologies, Inc. Applications for these super-compact computational modules are abundant. Relevent applications include: robotics, rugged military platforms, sensor processing, radar signal processing, missile applications, etc. |
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Our technology group has the capability to quickly miniaturize your design using a widerange of advanced packaging techniques. In these advanced packages, any combination of bare die, bumped die, and discretesurface mount components are interconnected with a high-performance substrate,and encapsulated if desired. This approach allows more flexibility, quicker time to market, and often compares favorably with system-on-a-chip approach. This results because each function is implemented in theappropriate process technology and extraneous features eliminated. Our designers can extend these packaging techniques formost types of applications using advanced laminate substrates such as 'flex' and/or 'rigid-flex'.