CAPABILITIES

NxGEN Electronics offers a wide variety of customer product engineering services focused on employing the latest in advanced packaging. This activity starts with preliminary consulting services to evaluate and determine the optimum packaging solution. All aspects of electronic interconnect solutions are available, including package and substrate design and lay-out, thermal analysis, high-speed simulation, process development, test engineering, and materials procurement. Technology assessment generally involves short turnaround times and consist of one or more of the following activities:

Packaging Design Services

Evaluation of die to be packaged
Tape layout
Lead design
Tolerance analysis
Thermal analysis
Strip layouts
Outputs for tape manufacturing
Cost modeling
Drawings and documentation

Simulation and Modeling

Electrical
Mechanical
Thermal

Prototype and Pre-production Assembly

Prototype builds
Process enhancement and development
Tooling and fixture design
Materials evaluation

Reliability / Failure Analysis

Reliability evaluation (JEDEC pre-conditioning, temperature humidity,autoclave, temperature cycle, hightemperature storage)
Burn-in and operational life testing
SEM (Scanning Electron Microscopy)
X-ray radiographic
Optical microscopy
Cross-sectioning

Service/Products

Leading-edge microelectronic design, assembly, and test
Systems-in-a-Package (SIP)
Custom microelectronic componentsand systems
Hybrid and advanced high-density design and assembly Unique RF assembly and test experience
Wafer bumping
High-density flip chip and stud bumping
Low-temperature processes for optoelectronic and MENS modules
Obsolete module replacement
Quick-turn prototypes leading tovolume turnkey services
Patented RAD Space and Military component design and assembly

Special Competencies and Features

Advanced packaging requirements transcend the world of high-density applications.

To date, NxGEN has designed and manufactured productsfor a wide variety of applications including:

implantable medical device;
optical switches;
MEMS devices;
RF amplifiers;
digital signalprocessing;
ATE pin-head electronics;
military high-voltage applications;
smart cards;
embedded computers for missiles;
++ many others.

This wide range of applications have at their core a common element — the willingness to listen to our customers and relentless pursuit of employing the most innovative technologies.

Experience

The design experience of our staff isvery diverse in order to successfully complete the designs listed above. Additionally, we draw on outside resources toprovide design guidance and checks for the most difficult challenges. Having worked in many other companies and capacities, our network of consultants include many recognized experts in their fields.