THE COMPANY

NxGEN Electronics is a microelectronics design, contract manufacturing, packaging, and custom assembly company dedicated to supplying prototypes to finished microelectronic products, advanced packaging technologies, and high density electronic assembly services to a wide range of industrial, medical, military, and satellite customers. The business focus is aimed at applications within these industries where size, weight, power consumption, and cost of packaged electronics are to be reduced to the minimum. NxGEN's management has over 100 years of experience in the electronics industry. NxGEN and its affiliated companies represent significant leading edge industry expertise in chip design, package design and assembly, PCB design and assembly, testing, space effects, system engineering, and program management.

As many companies attempt to optimize their competitive position, they constantly push the technology envelope of physical integration of their products, requiring advanced electronic design and packaging. For example, eliminating wirebonds in Integrated Circuit packages can be accomplished with "Flip-Chip" technology, resulting in higher speed performance, smaller size, and weight reduction.

Location and Facilities

NxGEN operates a modern engineering and production facility, with a 5,000 square foot, class 10,000 clean room, at 9771 Clairemont Mesa Blvd., Clairemont Mesa Boulevard, San Diego, California 92124. The Company competes by offering the most advanced packaging skill set, including:

Chip & Wire for pad size as small as 2 mils
BGA and PGA packages for high density interconnect
low temperature processing for OptoElectronics, and MEM's applications
Electrical testing
Burn-in
Screening services

Quality Systems are based on MIL-I-45208, MIL-STD-883 and ISO 9001-2000 requirements. NxGEN is in the process of receiving ISO and MIL qualification. NxGEN's services and responsiveness builds customer loyalty and repeat orders, the best indicator of "happy customers".

Competitive Advantages

NxGEN Electronics' design, assembly, and manufacturing skills will help you:

Free up internal resources to focus on core strengths
Reduce risk with our broad-based, high-density packaging, product design, and test experience
Integrate multiple advanced assembly technologies in one module
- Chip & Wire and SMT
- Flip Chip and SMT
- Flip Chip and BGA
- MCM - Multi-chip, hybrid modules
- MEMS and MicroZ(TM) Ball Stack Packages

In addition, consistency and reliability are a priority with all our products. Continual process improvement and constant attention to quality control help you reduce your costs and improve yield.