NxGEN Electronics is a microelectronics design, contract manufacturing, packaging, and custom assembly company committed to offering prototypes to completed microelectronic products, sophisticated packaging technologies, and high-density electronic assembly services to a wide variety of industrial, medical, military, and satellite clients. The business focus targets applications within these industries where size, weight, power consumption, and cost of packaged electronics are to be lowered to the minimum. NxGEN’s management has over A century of experience in the electronics industry. NxGEN and its associated companies represent considerable state of the art industry expertise in chip design, package design and assembly, PCB design and assembly, testing, space effects, system engineering, and program management.
Since a lot of companies endeavor to improve their competitive position, they continuously push the technology envelope of physical integration of their products, demanding advanced electronic design and packaging. As an example, getting rid of wirebonds in Integrated Circuit packages can be achieved with “Flip-Chip” technology, leading to higher speed performance, more compact size, and losing weight.
Geographic location and Facilities
NxGEN runs a contemporary engineering and production facility, with a 5,000 sq. ft., class 10,000 clean room, at 9771 Clairemont Mesa Blvd., Clairemont Mesa Boulevard, San Diego, California 92124. The Company competes by providing the most sophisticated packaging set of skills, including:
- Chip & Wire for pad size no more than 2 mils
- BGA and PGA packages for high-density interconnect
- low temp processing for OptoElectronics, and MEM’s applications
- Electrical testing
- Screening services
Quality Systems are based on MIL-I-45208, MIL-STD-883 and ISO 9001-2000 requirements. NxGEN is in the process of receiving ISO and MIL qualification. NxGEN’s services and responsiveness builds customer loyalty and repeat orders, the best indicator of “happy customers”.
NxGEN Electronics’ design, assembly, and manufacturing skills will help you:
Free up internal resources to concentrate on core strengths
Decrease risk with our broad-based, high-density packaging, product design, and test experience
Integrate multiple advanced assembly technologies in one module
– Chip & Wire and SMT
– Flip Chip and SMT
– Flip Chip and BGA
– MCM – Multi-chip, hybrid modules
– MEMS and MicroZ(TM) Ball Stack Packages
Additionally, consistency and reliability certainly are a priority with all of our products. Continual process improvement and constant concentration on quality control make it easier to lower your costs and boost yield.